Morten Stendahl Jellesen

Morten Stendahl Jellesen

Senior Researcher

DTU MECHANICAL ENGINEERING
Department of Mechanical Engineering

Section of Materials and Surface Engineering

Technical University of Denmark

Produktionstorvet

Building 425, room 028

2800 Kgs. Lyngby

Ph.
Fax +45 45 93 62 13
E-mail msj@mek.dtu.dk
ORCID 0000-0002-3253-0351
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2019
 

Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, Salil ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Microelectronics Reliability, vol: 93, pages: 81-88

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2019     |    DOI: https://doi.org/10.1016/j.microrel.2018.12.010

2018
 

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, Kamila ; Din, Rameez Ud ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: I E E E Transactions on Components, Packaging and Manufacturing Technology, vol: 8, issue: 10, pages: 1756-1768

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1109/TCPMT.2018.2792047

 

Electrochemical Screening Spot Test Method for Detection of Nickel and Cobalt Ion Release From Metal Surfaces

Jellesen, Morten S. ; Olsen, Christian Bang ; Ruff, Samine ; Spiewak, Radoslaw ; Hamann, Dathan ; Hamann, Carsten R. ; White, Ian R. ; Johansen, Jeanne D. ; Thyssen, Jacob Pontoppidan
in: Dermatitis, vol: 29, issue: 4, pages: 187-192

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1097/DER.0000000000000389

 

Future trends in gaseous surface hardening of titanium and titanium alloys

Christiansen, T. L. ; Jellesen, M.S. ; Somers, M.A.J.
in: La Metallurgia Italiana, issue: 9, pages: 13-22

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018

 

Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

Conseil-Gudla, H. ; Staliulionis, Z. ; Mohanty, S. ; Jellesen, M. S. ; Hattel, J. H. ; Ambat, R.
in: Microelectronics Reliability, vol: 82, pages: 136-146

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1016/j.microrel.2018.01.013

 

Metals and Corrosion

Jellesen, Morten Stendahl
part of: Metal Allergy, pages: 17-22, 2018, Springer

Type: Book chapter (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1007/978-3-319-58503-1_2

 

Nickel and cobalt release from fidget spinners on the Danish market

Ahlström, Malin G. ; Thyssen, Jacob P. ; Menné, Torkil ; Jellesen, Morten S. ; Westermann, Peter J. S. ; Johansen, Jeanne D.
in: Contact Dermatitis, vol: 78, issue: 5, pages: 357-359

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1111/cod.12924

 

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Piotrowska, Kamila ; Ud Din, Rameez ; Grumsen, Flemming Bjerg ; Jellesen, Morten Stendahl ; Ambat, Rajan
in: Journal of Electronic Materials, vol: 47, issue: 7, pages: 4190-4207

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.1007/s11664-018-6311-9

 

Water film formation on the PCBA surface and failure occurrence in electronics

Piotrowska, Kamila ; Jellesen, Morten S. ; Ambat, Rajan
part of: Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018) , pages: 72-76, 2018, IEEE
Presented at:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NORDPAC 2018)

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2018     |    DOI: https://doi.org/10.23919/NORDPAC.2018.8423854