Helene Conseil

Helene Conseil

PhD student

DTU MECHANICAL ENGINEERING
Department of Mechanical Engineering

Section of Materials and Surface Engineering

Technical University of Denmark

Produktionstorvet

Building 425, room 117

2800 Kgs. Lyngby

Ph.
Fax +45 45 25 19 61
E-mail helco@mek.dtu.dk
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2017
 

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: Journal of Electronic Materials (ISSN: 0361-5235) (DOI: http://dx.doi.org/10.1007/s11664-016-4974-7), vol: 46, issue: 2, pages: 817–825, 2017

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: http://dx.doi.org/10.1007/s11664-016-4974-7

 

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Conseil, Helene ; Gudla, Visweswara Chakravarthy ; Borgaonkar, Shruti ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: Journal of Materials Science: Materials in Electronics (ISSN: 0957-4522) (DOI: http://dx.doi.org/10.1007/s10854-016-6292-5), vol: 28, issue: 8, pages: 6138-6151, 2017

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: http://dx.doi.org/10.1007/s10854-016-6292-5

 

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil, Helene ; Staliulionis, Zygimantas ; Jellesen, Morten Stendahl ; Jabbaribehnam, Mirmasoud ; Hattel, Jesper Henri ; Ambat, Rajan
in journal: I E E E Transactions on Components, Packaging and Manufacturing Technology (ISSN: 2156-3950) (DOI: http://dx.doi.org/ 10.1109/TCPMT.2017.2655447), vol: 7, issue: 3, pages: 412 - 423, 2017

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2017     |    DOI: http://dx.doi.org/ 10.1109/TCPMT.2017.2655447

2016
 

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

Conseil, Helene ; Verdingovas, Vadimas ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: Journal of Materials Science: Materials in Electronics (ISSN: 0957-4522) (DOI: http://dx.doi.org/10.1007/s10854-015-3712-x), pages: 23-32, 2016

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: http://dx.doi.org/10.1007/s10854-015-3712-x

  PDF

Experimental study of humidity distribution inside electronic enclosure and effect of internal heating

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the European Corrosion Congress : EUROCORR 2015, 2016,
Presented at:
The European Corrosion Congress - EUROCORR 2015, 2015, Graz

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016

 

Humidity Build-Up in a Typical Electronic Enclosure Exposed to Cycling Conditions and Effect on Corrosion Reliability

Conseil, Helene ; Gudla, Visweswara Chakravarthy ; Jellesen, Morten Stendahl ; Ambat, Rajan
in journal: I E E E Transactions on Components, Packaging and Manufacturing Technology (ISSN: 2156-3950) (DOI: http://dx.doi.org/10.1109/TCPMT.2016.2590779), vol: 6, issue: 9, pages: 1379-1388, 2016

Type: Journal article (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: http://dx.doi.org/10.1109/TCPMT.2016.2590779

 

Semi-empirical prediction of moisture build-up in an electronic enclosure using analysis of variance (ANOVA)

Shojaee Nasirabadi, Parizad ; Conseil, Helene ; Mohanty, Sankhya ; Jabbaribehnam, Mirmasoud ; Ambat, Rajan ; Hattel, Jesper Henri
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 785-790, 2017, IEEE,
Presented at:
18th Electronics Packaging Technology Conference (EPTC), 2016, Singapore

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: http://dx.doi.org/ 10.1109/EPTC.2016.7861588

 

Improving intrinsic corrosion reliability of printed circuit board assembly

Ambat, Rajan ; Conseil, Helene
part of: Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) , pages: 540-544, 2017, IEEE,
Presented at:
18th Electronics Packaging Technology Conference (EPTC), 2016, Singapore

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2016     |    DOI: http://dx.doi.org/10.1109/EPTC.2016.7861538

2015
 

Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles

Conseil, Helene ; Jellesen, Morten Stendahl ; Ambat, Rajan
part of: Proceedings of the IMAPS Nordic Annual Conference 2015 (ISBN: 9781510808133), pages: 111-117, 2016, International Microelectronics and packaging Society,
Presented at:
IMAPS Nordic Annual Conference 2015, 2015, Helsingør

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2015

2014
  PDF

Perspectives on the climatic reliability issues of electronic devices

Ambat, Rajan ; Jellesen, Morten Stendahl ; Verdingovas, Vadimas ; Piotrowska, Kamila ; Conseil, Helene
part of: Proceedings of EuroCorr 2014, 2014,
Presented at:
European Corrosion Congress, 2014, Pisa

Type: Article in proceedings (Peer reviewed)

Status: Published     |    Year: 2014